Thermal module with airflow guiding function

ABSTRACT

A thermal module includes a fan device having a fan and a fan housing for covering the fan. A vent is disposed on the fan housing. The thermal module further includes an airflow guiding device installed on the fan housing and disposed on a side of the vent for guiding airflow into the vent.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a thermal module, and moreparticularly, to a thermal module with airflow guiding function.

2. Description of the Prior Art

Consumer electronic products have more and more functions with progressof technology. Hence the demand for performance increases accordingly.The high performance brings high energy consumption resulting inresonance, noise, thermal problems, and so on. For example, thereliability and stability of electronic products reduce if heatgenerated by internal electronic components can not be dissipatedeffectively. The conventional solution of thermal problem is utilizing athermal system, such as a fan, a heat sink, a heat pipe, or a coolingchip for reducing temperature of the electronic components so that theelectronic products can operate normally.

For instance, heat transmitted from electronic components on the motherboard to a housing made of plastic or metal material, so that a palmrest on a notebook computer often has high temperature causinguncomfortable feeling of a user. However, the thermal module, such asthermal fins and the heat pipe, can not be disposed in a small gapbetween the mother board and the housing. For solving this problem, thetemperature of the heat source can be reduced by airflow passingtherethrough. For example, a guiding channel formed by sponge or plasticbaffle for guiding airflow from the fan to the heat source can dissipatehot air around the heat source. However there is no airflow guidingstructure applied for the fan, and the fan inhales surrounding cold airat lower flow resistance more easily than the hot air passing throughthe guiding channel in the system. It is disadvantageous to reducesurface temperature of the palm rest due to poor heat-dissipatingefficiency.

SUMMARY OF THE INVENTION

A thermal module includes a fan device having a fan and a fan housingfor covering the fan. A vent is disposed on the fan housing. The thermalmodule further includes an airflow guiding device installed on the fanhousing and disposed on a side of the vent for guiding airflow into thevent.

According to the claimed invention, the airflow guiding device is an arcstructure.

According to the claimed invention, the airflow guiding device isintegrated with the fan housing monolithically.

According to the claimed invention, the airflow guiding device is gluedto the fan housing.

According to the claimed invention, the airflow guiding device isinstalled on the fan housing in a slidable manner.

According to the claimed invention, a groove is formed on the housing,and the airflow guiding device includes a sliding component installedinside the groove in a slidable manner, and a fixing component connectedto the sliding component for fixing the sliding component inside thegroove.

According to the claimed invention, a first ratchet structure isdisposed on a side of the groove and a second ratchet structure isdisposed on the fixing component for engaging with the first ratchetstructure.

According to the claimed invention, an opening is formed on a side ofthe groove and the fixing component is capable of passing through theopening.

According to the claimed invention, the groove is an arc groove and thesliding component is an arc structure.

According to the claimed invention, the airflow guiding device isinstalled on the fan housing in a protrudable manner.

According to the claimed invention, a slot is formed on the fan housing,and the airflow guiding device includes a protruding component installedinside the slot in a protrudable manner, and at least one elasticcomponent connected to the protruding component for providing elasticforce to the protruding component.

According to the claimed invention, at least one positioning hole isformed on a side of the slot, and a positioning component is disposed onthe protruding component corresponding to the positioning hole forinserting into the positioning hole so as to fix the protrudingcomponent in the slot.

According to the claimed invention, at least one pin is formed on theslot, at least one pillar is disposed on the protruding componentcorresponding to the pin, and the elastic component sheathes the pin andis installed inside the pillar.

According to the claimed invention, the slot is an arc slot and theprotruding component is an arc structure.

According to the claimed invention, the elastic component is a spring.

According to the claimed invention, the thermal module further includesan elastic pad installed on a side of the airflow guiding device.

According to the claimed invention, the elastic pad is made of rubbermaterial.

According to the claimed invention, the airflow guiding device is abaffle.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective drawing of a thermal module installed inside ahousing according to a first embodiment of the present invention.

FIG. 2 is an exploded diagram of the thermal module installed inside thehousing according to the first embodiment of the present invention.

FIG. 3 is a sectional view of the thermal module installed inside thehousing according to the first embodiment of the present invention.

FIG. 4 is a diagram of the thermal module according to the firstembodiment of the present invention.

FIG. 5 is a perspective drawing of a thermal module according to asecond embodiment of the present invention.

FIG. 6 is an exploded diagram of the thermal module according to thesecond embodiment of the present invention.

FIG. 7 is a diagram of the airflow guiding device according to thesecond embodiment of the present invention.

FIG. 8 is a diagram of a thermal module in a guiding condition accordingto a third embodiment of the present invention.

FIG. 9 is a sectional view of the thermal module in the guidingcondition according to the third embodiment of the present invention.

FIG. 10 is a diagram of the thermal module in a non-guiding conditionaccording to the third embodiment of the present invention.

FIG. 11 is a sectional view of the thermal module in the non-guidingcondition according to the third embodiment of the present invention.

FIG. 12 is an exploded drawing of the thermal module according to thethird embodiment of the present invention.

FIG. 13 is a diagram of the airflow guiding device according to thethird embodiment of the present invention.

FIG. 14 is a diagram of a thermal module according to a fourthembodiment of the present invention.

FIG. 15 is an exploded drawing of the thermal module according to thefourth embodiment of the present invention.

DETAILED DESCRIPTION

Please refer to FIG. 1 to FIG. 4. FIG. 1 is a perspective drawing of athermal module 50 installed inside a housing according to a firstembodiment of the present invention. FIG. 2 is an exploded diagram ofthe thermal module 50 installed inside the housing according to thefirst embodiment of the present invention. FIG. 3 is a sectional view ofthe thermal module 50 installed inside the housing according to thefirst embodiment of the present invention. FIG. 4 is a diagram of thethermal module 50 according to the first embodiment of the presentinvention. The thermal module 50 can be installed inside a computersystem, such as a notebook computer, and fixed on a substrate 52 whichcan be a thermal conductive substrate or a circuit board. The substrate52 can be disposed selectively. The thermal module 50 is installedbetween a first casing 54 and a second casing 56. The first casing 54and the second casing 56 cover internal components together. Forexample, the first casing 54 can be a bottom casing, and the secondcasing 56 can be an upper casing. A first opening 541 and a secondopening 542 are disposed on the first casing 54. The thermal module 50inhales cold air via the first opening 541 and exhausts hot air via thesecond opening 542. For showing the disposition of the thermal module50, the first opening 541, and the second opening 542 clearly, thesecond casing 56 is omitted to display in FIG. 1. As shown in FIG. 2,the thermal module 50 includes a fan device 58 for inhaling the cold airvia the first opening 541 and exhausts the hot air via the secondopening 542. The fan device 58 includes a fan 60 and a fan housing 62for covering the fan 60. A first vent 621, a second vent 622, and anoutlet 623 are disposed on the fan housing 62. The fan 60 inhales thecold air via the first vent 621 and the second vent 622 and exhausts thehot air via the outlet 623. The first vent 621 is located in a positioncorresponding to the first opening 541 on the first casing 54. Mostairflow enters into the fan 60 via the first opening 541 on the firstcasing 54 with higher porosity and the first vent 621 perpendicularly.The second vent 622 often faces the motherboard or the upper casing withlower porosity so that airflow has to enter into the fan 60 through agap between the fan device 58 and the second casing 56. Furthermore, thefan device 58 can be connected to other heat-dissipating components,such as a heat pipe or thermal fins, for dissipating heat transmittedfrom the other heat-dissipating components with forced convectionmethod.

The thermal module 50 further includes an airflow guiding device 64installed on the fan housing 62 and disposed on a side of the first vent621 for guiding airflow into the first vent 621. In this embodiment, theairflow guiding device 64 can be an arc structure and a baffle. Theairflow guiding device 64 can be integrated with the fan housing 62monolithically or be glued to the fan housing 62. The airflow guidingdevice 64 can be made of plastic, sponge, or metal material. As shown inFIG. 3, when the airflow enters the second vent 622 through the gaparound the second vent 622, the airflow guiding device 64 can guide theairflow around the fan device 58, that is, the airflow guiding device 64can block the airflow passing through the second vent 622 laterally soas to guide the airflow to flow downward into the second vent 622.Furthermore, the airflow guiding device 64 can increase the gap ofairflow inhalation for preventing other objects from contacting with thefan device 58 directly so as to reduce the gap of airflow inhalation.The airflow can be guided to flow into the second vent 622 in apredetermined direction by disposition of the airflow guiding device 64.For example, the airflow guiding device 64 can be orientated to face theheat source with high temperature so that the airflow guiding device 64can guide the hot airflow from the heat source with high temperatureinto the second vent 622 for increasing heat-dissipating efficiency. Theairflow guiding device 64 also can be disposed to guide the airflow toflow through electronic components with heat below the palm rest firstand then enter into the fan device 58 so as to reduce the temperature ofthe palm rest and provide comfortable feeling for the user. The arcstructure of the airflow guiding device 64 can be oriented according todisposition of the heat source and cooperates with conventional airflowguiding mechanism together for dissipating heat outside smoothly.

Please refer FIG. 5 and FIG. 6. FIG. 5 is a perspective drawing of athermal module 80 according to a second embodiment of the presentinvention. FIG. 6 is an exploded diagram of the thermal module 80according to the second embodiment of the present invention. The thermalmodule 80 includes a fan device 82 having a fan housing 84 for coveringa fan, which is not shown in figures for displaying other componentsclearly. A groove 841 is formed on the fan housing 84, and the groove841 can be an arc groove. A first ratchet structure 86 is disposed on aside of the groove 841, and an opening 88 is disposed within the firstratchet structure 86. The thermal module 80 further includes an airflowguiding device 90. The difference between the first embodiment and thesecond embodiment is that the airflow guiding device 90 is installed onthe fan housing 84 in a slidable manner for adjusting inhaling directionof the fan device 82 conveniently. Please refer to FIG. 5 to FIG. 7.FIG. 7 is a diagram of the airflow guiding device 90 according to thesecond embodiment of the present invention. The airflow guiding device90 includes a sliding component 92 installed inside the groove 841 in aslidable manner. The sliding component 92 can be an arc structure and abaffle. The airflow guiding device 90 further includes a fixingcomponent 94 connected to the sliding component 92 for fixing thesliding component 92 inside the groove 841. A second ratchet structure96 is disposed on the fixing component 94 for engaging with the firstratchet structure 86. For assembling the airflow guiding device 90 onthe fan housing 84, the fixing component 94 is aimed at the opening 88first so that the fixing component 94 can pass through the opening 88for disposing the sliding component 92 inside the groove 841. Theengagement of the first ratchet structure 86 and the second ratchetstructure 96 can fix the sliding component 92 inside the groove 841tightly. The sliding component 92 can rotate in the groove 841 toorientate at a specific angle. The principle of guiding airflow of thesecond embodiment is the same as the one of the first embodiment, andthe detailed description is omitted herein.

Please refer FIG. 8 to FIG. 12. FIG. 8 is a diagram of a thermal module100 in an airflow guiding condition according to a third embodiment ofthe present invention. FIG. 9 is a sectional view of the thermal module100 in the airflow guiding condition according to the third embodimentof the present invention. FIG. 10 is a diagram of the thermal module 100in a non airflow guiding condition according to the third embodiment ofthe present invention. FIG. 11 is a sectional view of the thermal module100 in the non airflow guiding condition according to the thirdembodiment of the present invention. FIG. 12 is an exploded drawing ofthe thermal module 100 according to the third embodiment of the presentinvention. The thermal module 100 includes a fan device 102 having a fanhousing 104 for covering a fan, which is not shown in figures fordisplaying other components clearly. A slot 1041 is formed on the fanhousing 104, and the slot 1041 can be an arc groove. Two positioningholes 106 are formed on both sides of the slot 1041 respectively. Thethermal module 100 further includes an airflow guiding device 108. Thedifference between the third embodiment, the first embodiment, and thesecond embodiment is that the airflow guiding device 108 is installed onthe fan housing 104 in a protrudable manner. When there is a need toutilize the airflow guiding device 108, the airflow guiding device 108can protrude from the fan housing 104; and when there is no need toutilize the airflow guiding device 108, the airflow guiding device 108can be contained in the fan housing 104. Please refer to FIG. 8 to FIG.13. FIG. 13 is a diagram of the airflow guiding device 108 according tothe third embodiment of the present invention. The airflow guidingdevice 108 includes a protruding component 110 installed inside the slot1041 in a protrudable manner. The protruding component 110 can be an arcstructure and a baffle. Two positioning components 112 are disposed onboth sides of the protruding component 110 respectively corresponding tothe positioning holes 106 for inserting into the positioning holes 106so as to fix the protruding component 110 in the slot 1041. A pluralityof pins 114 is formed on the slot 1041, and a plurality of pillars 116is disposed on the protruding component 110 corresponding to theplurality of pins 114 respectively. The airflow guiding device 108further includes a plurality of elastic components 118 for sheathing thepins 114 and installed inside the pillars 116 respectively. The elasticcomponent 118 is for providing elastic force to the protruding component110. The elastic component 118 can be a spring. The amount and thedisposition of the positioning holes 106, the positioning components112, the pins 114, the pillars 116, and the elastic components 118 arenot limited to this embodiment and can be designed according actualdemand.

When the user presses the protruding component 110 downward from theposition as shown in FIG. 8 and FIG. 9 to the position as shown in FIG.10 and FIG. 11, the positioning components 112 on the protrudingcomponent 110 insert into the lower positioning holes 106 and theelastic components 118 are compressed. As shown in FIG. 10, theprotruding component 110 is contained in the fan housing 104, and thethermal module 100 can not provide airflow guiding function. When theuser pulls the protruding component 110 upward from the position asshown in FIG. 10 and FIG. 11 to the position as shown in FIG. 8 and FIG.9, the elastic components 118 are not compressed anymore and provideelastic force to the protruding component 110 for lifting the protrudingcomponent 110 so that the positioning components 112 on the protrudingcomponent 110 insert into the higher positioning holes 106 respectively.As shown in FIG. 8, the protruding component 110 protrudes from the fanhousing 104 so that the thermal module 100 can provide airflow guidingfunction. The principle of guiding airflow of the third embodiment isthe same as the one of the previous embodiment, and the detaileddescription is omitted herein.

Please refer to FIG. 14 and FIG. 15. FIG. 14 is a diagram of a thermalmodule 120 according to a fourth embodiment of the present invention.FIG. 15 is an exploded drawing of the thermal module 120 according tothe fourth embodiment of the present invention. The thermal module 120includes a fan device 122 having a fan housing 124 for covering a fan,which is not shown in figures for displaying other components clearly.The thermal module 120 further includes an airflow guiding device 126installed on the fan housing 124. The airflow guiding device 126 can bean arc structure and a baffle. The airflow guiding device 126 can beintegrated with the fan housing 124 monolithically or be glued to thefan housing 124. The difference between the fourth embodiment and thefirst embodiment is that the thermal module 120 further includes anelastic pad 128 installed on a side of the airflow guiding device 126,such as being glued to the airflow guiding device 126. The elastic pad128 can be made of rubber material. The interference of the elastic pad128 and the second casing 56 in FIG. 2 can make the thermal module 120contact with the motherboard or the upper casing more tightly forpreventing the airflow from passing through the airflow guiding device126. The elastic pad 128 also can be applied for the previousembodiments, and the detailed description is omitted herein.

In contrast with the prior art, the present invention provides thethermal module with airflow guiding function for guiding the hot airfrom the heat source into the fan so as to increase heat-dissipatingefficiency. The arc structure of the airflow guiding device can beoriented according to the position of the heat source and cooperateswith conventional airflow guiding mechanism together for dissipatingheat outside smoothly.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

1. A thermal module comprising: a fan device comprising: a fan; and afan housing for covering the fan, a vent being disposed on the fanhousing; and an airflow guiding device installed on the fan housing anddisposed on a side of the vent for guiding airflow into the vent.
 2. Thethermal module of claim 1 wherein the airflow guiding device is an arcstructure.
 3. The thermal module of claim 1 wherein the airflow guidingdevice is integrated with the fan housing monolithically.
 4. The thermalmodule of claim 1 wherein the airflow guiding device is glued to the fanhousing.
 5. The thermal module of claim 1 wherein the airflow guidingdevice is installed on the fan housing in a slidable manner.
 6. Thethermal module of claim 5 wherein a groove is formed on the housing andthe airflow guiding device comprises: a sliding component installedinside the groove in a slidable manner; and a fixing component connectedto the sliding component for fixing the sliding component inside thegroove.
 7. The thermal module of claim 6 wherein a first ratchetstructure is disposed on a side of the groove and a second ratchetstructure is disposed on the fixing component for engaging with thefirst ratchet structure.
 8. The thermal module of claim 6 wherein anopening is formed on a side of the groove and the fixing component iscapable of passing through the opening.
 9. The thermal module of claim 6wherein the groove is an arc groove and the sliding component is an arcstructure.
 10. The thermal module of claim 1 wherein the airflow guidingdevice is installed on the fan housing in a protrudable manner.
 11. Thethermal module of claim 10 wherein a slot is formed on the fan housingand the airflow guiding device comprises: a protruding componentinstalled inside the slot in a protrudable manner; and at least oneelastic component connected to the protruding component for providingelastic force to the protruding component.
 12. The thermal module ofclaim 11 wherein at least one positioning hole is formed on a side ofthe slot, and a positioning component is disposed on the protrudingcomponent corresponding to the positioning hole for inserting into thepositioning hole so as to fix the protruding component in the slot. 13.The thermal module of claim 11 wherein at least one pin is formed on theslot, at least one pillar is disposed on the protruding componentcorresponding to the pin, and the elastic component sheathes the pin andis installed inside the pillar.
 14. The thermal module of claim 11wherein the slot is an arc slot and the protruding component is an arcstructure.
 15. The thermal module of claim 11 wherein the elasticcomponent is a spring.
 16. The thermal module of claim 1 furthercomprising an elastic pad installed on a side of the airflow guidingdevice.
 17. The thermal module of claim 16 wherein the elastic pad ismade of rubber material.
 18. The thermal module of claim 1 wherein theairflow guiding device is a baffle.